The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Dec. 01, 2017
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventor:

Pamela R. Nylander-Hill, Tucson, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/008 (2006.01); G11B 27/36 (2006.01); G11B 19/04 (2006.01); G11B 20/12 (2006.01); G06F 11/07 (2006.01); G11B 20/18 (2006.01); G11B 20/10 (2006.01);
U.S. Cl.
CPC ...
G11B 27/36 (2013.01); G06F 11/073 (2013.01); G06F 11/0787 (2013.01); G11B 5/00813 (2013.01); G11B 19/048 (2013.01); G11B 20/1205 (2013.01); G11B 20/10305 (2013.01); G11B 20/18 (2013.01); G11B 2020/1265 (2013.01); G11B 2020/1292 (2013.01);
Abstract

A computer program product, according to one embodiment, includes a computer readable storage medium having program instructions embodied therewith. The computer readable storage medium is not a transitory signal per se. Moreover, the program instructions readable and/or executable by a controller to cause the controller to perform a method which includes: collecting, by the controller, data relating to operation of a tape drive; storing, by the controller, the collected data in wrap sections of a tape map; and storing, by the controller, a subset of the collected data in a slice region upon experiencing a first trigger condition and/or upon reaching a predefined location on a tape. Moreover, the wrap sections of the tape map correlate to physical lengths of tape. Other systems, methods, and computer program products are described in additional embodiments.


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