The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Jul. 14, 2015
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Joseph Kuczynski, North Port, FL (US);

Arvind K. Sinha, Los Alamos, NM (US);

Kevin A. Splittstoesser, Stewartville, MN (US);

Timothy J. Tofil, Rochester, MN (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06G 7/48 (2006.01); G06G 7/50 (2006.01); G06F 17/50 (2006.01);
U.S. Cl.
CPC ...
G06F 17/5018 (2013.01); G06F 17/5068 (2013.01);
Abstract

In an example, a method includes storing thermoset resin rheology data associated with a thermoset resin at a memory. The thermoset resin rheology data includes a plurality of sets of dynamic fluid flow properties that are measured for the thermoset resin. The method includes receiving, at a computing device, information associated with a printed circuit board (PCB) laminate design. The method also includes receiving, at the computing device, a first set of PCB lamination parameters. The method further includes storing, at the computing device, a first thermoset resin flow model. The first thermoset resin flow model is generated based on the thermoset resin rheology data, the information associated with the PCB laminate design, and the first set of PCB lamination parameters.


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