The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2019
Filed:
Jan. 23, 2015
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 31/00 (2006.01); G01R 31/26 (2014.01); G01R 1/04 (2006.01); G01K 1/14 (2006.01); G01K 7/00 (2006.01); G01K 7/01 (2006.01); G01K 7/16 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2601 (2013.01); G01K 1/14 (2013.01); G01K 7/00 (2013.01); G01K 7/01 (2013.01); G01R 1/0408 (2013.01); G01R 1/0433 (2013.01); G01R 1/0483 (2013.01); G01K 2007/163 (2013.01); G01R 31/26 (2013.01);
Abstract
A base having electrical conductivity and a plate shape for a semiconductor device evaluation jig has a front surface which includes a mount region where a semiconductor device is to be mounted. In this mount region, the base has a through hole extending through the base. A temperature detecting element is attached to the base. An electrode pad is electrically connected to the temperature detecting element and formed in the front surface side.