The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2019
Filed:
Aug. 07, 2015
Applicant:
Dunan Sensing Llc, San Jose, CA (US);
Inventor:
Tom T. Nguyen, San Jose, CA (US);
Assignee:
DUNAN SENSING LLC, San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01D 11/24 (2006.01); B81C 3/00 (2006.01); B81C 1/00 (2006.01); H01L 23/10 (2006.01); G01L 19/14 (2006.01); G01L 19/06 (2006.01); B23P 11/00 (2006.01); G12B 9/06 (2006.01); B81B 7/00 (2006.01); G01L 5/16 (2006.01); G01D 11/26 (2006.01);
U.S. Cl.
CPC ...
G01D 11/245 (2013.01); B23P 11/005 (2013.01); B81C 1/00325 (2013.01); B81C 3/008 (2013.01); G01D 11/26 (2013.01); G01L 5/165 (2013.01); G01L 19/0672 (2013.01); G01L 19/14 (2013.01); G01L 19/145 (2013.01); H01L 23/10 (2013.01); B81B 7/0032 (2013.01); B81B 2201/0264 (2013.01); B81C 1/00261 (2013.01); B81C 3/00 (2013.01); B81C 2203/019 (2013.01); G12B 9/06 (2013.01); Y10T 29/49872 (2015.01); Y10T 29/49874 (2015.01); Y10T 29/49913 (2015.01); Y10T 29/49915 (2015.01);
Abstract
Apparatus and Methods for fabricating apparatus having a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.