The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

May. 18, 2015
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventors:

Hui Ling Pan, Shanghai, CN;

Hiu Tung Chu, Shanghai, CN;

Paul Scott Martin, San Jose, CA (US);

Jianzhong Pan, Shanghai, CN;

Hua Sin Daniel Yew, Bayan Lepas, MY;

Assignee:

Koninklijke Philips N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F21V 5/00 (2018.01); F21S 43/19 (2018.01); F21S 43/14 (2018.01); F21K 9/00 (2016.01); F21K 9/90 (2016.01); H01L 33/62 (2010.01); H01L 25/075 (2006.01); F21S 45/47 (2018.01); F21S 43/20 (2018.01); B60Q 1/30 (2006.01); B60Q 1/34 (2006.01); F21S 43/15 (2018.01); F21W 103/00 (2018.01); F21Y 115/10 (2016.01); F21Y 107/20 (2016.01);
U.S. Cl.
CPC ...
F21S 43/195 (2018.01); B60Q 1/30 (2013.01); B60Q 1/34 (2013.01); F21K 9/00 (2013.01); F21K 9/90 (2013.01); F21S 43/14 (2018.01); F21S 43/15 (2018.01); F21S 43/26 (2018.01); F21S 45/47 (2018.01); H01L 25/0753 (2013.01); H01L 33/62 (2013.01); B60Q 2400/00 (2013.01); F21W 2103/00 (2018.01); F21Y 2107/20 (2016.08); F21Y 2115/10 (2016.08); H01L 2924/0002 (2013.01);
Abstract

An LED lamp includes a metal lead frame strip () on which is directly mounted bare LED dies (), such as in series. Therefore, there is excellent thermal conductivity to the lead frame (). Lenses () are then molded over the LED dies () to encapsulate them. The lead frame () is then inserted into a mold for a thermally conductive plastic body () and is bent in an arc while in the mold so that the top surfaces of the LED dies () are not parallel to each other. The plastic body is molded, and the structure is removed from the mold. The curved lead frame causes the overall light emission to be very wide, such a greater than 270 degrees. In another embodiment, the lead frame strip is supported over a curved outer surface of a pre-molded plastic support. Ends of the lead frame strip are inserted into electrical connectors of the plastic support.


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