The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

May. 08, 2015
Applicant:

Diamond Innovations, Inc., Worthington, OH (US);

Inventors:

Christopher Allen Long, Westerville, OH (US);

Andrew Gledhill, Westerville, OH (US);

Assignee:

Diamond Innovations, Inc., Worthington, OH (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
E21B 10/567 (2006.01); E21B 10/573 (2006.01); B24D 3/10 (2006.01); B22F 5/00 (2006.01); B22F 3/14 (2006.01); B24D 18/00 (2006.01); B24D 99/00 (2010.01); C22C 11/00 (2006.01); C22C 26/00 (2006.01); B22F 3/24 (2006.01); B22F 3/15 (2006.01); C22C 27/04 (2006.01); C22C 27/06 (2006.01);
U.S. Cl.
CPC ...
E21B 10/567 (2013.01); B22F 3/14 (2013.01); B22F 3/24 (2013.01); B22F 5/00 (2013.01); B24D 3/10 (2013.01); B24D 18/0009 (2013.01); B24D 99/00 (2013.01); C22C 11/00 (2013.01); C22C 26/00 (2013.01); E21B 10/5735 (2013.01); B22F 3/15 (2013.01); B22F 2005/001 (2013.01); B22F 2301/30 (2013.01); B22F 2302/406 (2013.01); B22F 2303/30 (2013.01); B22F 2998/10 (2013.01); C22C 27/04 (2013.01); C22C 27/06 (2013.01);
Abstract

Polycrystalline diamond cutting elements having enhanced thermal stability, drill bits incorporating the same, and methods of making the same are disclosed herein. In one embodiment, a cutting element includes a substrate having a metal carbide and a polycrystalline diamond body bonded to the substrate. The polycrystalline diamond body includes a plurality of diamond grains bonded to adjacent diamond grains by diamond-to-diamond bonds and a plurality of interstitial regions positioned between adjacent diamond grains. At least a portion of the plurality of interstitial regions comprise lead or lead alloy, a catalyst material, metal carbide, or combinations thereof. At least a portion of the plurality of interstitial regions comprise lead or lead alloy that coat portions of the adjacent diamond grains such that the lead or lead alloy reduces contact between the diamond and the catalyst.


Find Patent Forward Citations

Loading…