The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Sep. 28, 2015
Applicant:

Caterpillar Inc., Peoria, IL (US);

Inventors:

Robert L. Meyer, Metamora, IL (US);

Fernando Martinez Diez, Dunlap, IL (US);

Assignee:

Caterpillar Inc., Deerfield, IL (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B32B 15/01 (2006.01); B23K 9/04 (2006.01); C21D 9/00 (2006.01); B62D 55/26 (2006.01); B23K 35/30 (2006.01); C21D 1/18 (2006.01); C21D 1/60 (2006.01); C22C 38/00 (2006.01); C22C 38/02 (2006.01); C22C 38/04 (2006.01); C22C 38/22 (2006.01); B23K 9/00 (2006.01); C21D 1/06 (2006.01); B23K 101/34 (2006.01); B23K 103/04 (2006.01); B23K 103/18 (2006.01);
U.S. Cl.
CPC ...
C21D 9/0068 (2013.01); B23K 9/0026 (2013.01); B23K 9/042 (2013.01); B23K 35/308 (2013.01); B32B 15/01 (2013.01); B32B 15/011 (2013.01); B62D 55/26 (2013.01); C21D 1/06 (2013.01); C21D 1/18 (2013.01); C21D 1/60 (2013.01); C22C 38/00 (2013.01); C22C 38/002 (2013.01); C22C 38/02 (2013.01); C22C 38/04 (2013.01); C22C 38/22 (2013.01); B23K 2101/34 (2018.08); B23K 2103/04 (2018.08); B23K 2103/05 (2018.08); B23K 2103/18 (2018.08); Y10T 428/12972 (2015.01);
Abstract

A hardfacing process includes depositing a clad layer having a thickness greater than about 1 mm (0.04 in) on a surface of the component by arc welding, and creating a heat affected zone directly below the clad layer due to the depositing. The heat affected zone may be a region of the component where a lowest hardness is more than 40% lower than a base hardness of the component below the heat affected zone. The method may also include heat treating the component after the deposition such that the lowest hardness in the heat affected zone is restored to within about 15% of the base hardness of the component.


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