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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10167418 B1

PDFFull Text
Date of Patent:
Jan. 01, 2019

Filed:

Jun. 16, 2015

Hot melt silicone and curable hot melt composition

Applicant:

Dow Corning Toray Co., Ltd., Tokyo, JP;

Inventors:

Haruna Yamazaki, Ichihara, JP;

Makoto Yoshitake, Ichihara, JP;

Ryosuke Yamazaki, Ichihara, JP;

Assignee:

Dow Corning Co., Ltd., Tokyo, JP;

Attorney:

Howard & Howard Attorneys PLLC

Primary Examiner:

Kuo Liang Peng

Int. Cl.
CPC ...
C09J 183/04 (2006.01); C09J 11/00 (2006.01); C08G 77/12 (2006.01); C08G 77/16 (2006.01); C08K 3/22 (2006.01); C08K 5/5419 (2006.01); C08K 5/56 (2006.01); C08L 83/04 (2006.01); C09D 183/04 (2006.01); C08L 83/00 (2006.01); C08G 77/18 (2006.01); C08G 77/20 (2006.01); C08G 77/00 (2006.01);
U.S. Cl.
CPC ...
C09J 183/04 (2013.01); C08G 77/12 (2013.01); C08G 77/16 (2013.01); C08K 3/22 (2013.01); C08K 5/5419 (2013.01); C08K 5/56 (2013.01); C08L 83/00 (2013.01); C08L 83/04 (2013.01); C09D 183/04 (2013.01); C09J 11/00 (2013.01); C08G 77/18 (2013.01); C08G 77/20 (2013.01); C08G 77/80 (2013.01);
Abstract

A hot melt silicone that is non-flowable at 25° C. and that has a melt viscosity at 100° C. of 5,000 Pa·s or less, the hot melt silicone being formed by subjecting (A) an alkenyl group-containing organopolysiloxane in which 10 mol % or greater of all of silicon atom-bonded organic groups is a phenyl group, and (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule to hydrosilylation reaction in the presence of (C) a hydrosilylation reaction catalyst; and a curable hot melt composition comprising: (I) the hot melt silicone; (II) an organopolysiloxane which has at least two silicon atom-bonded hydrogen atoms in a molecule and in which the amount of silicon atom-bonded hydrogen atom is 0.5 mass % or greater; and (III) a hydrosilylation reaction catalyst. The hot melt silicone is non-flowable at 25° C., has a low surface stickiness, and easily melts by heating. Furthermore, this curable hot melt composition has both hot melt properties and curability.

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