The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 01, 2019

Filed:

Aug. 24, 2017
Applicant:

Kionix, Inc., Ithaca, NY (US);

Inventors:

Martin Heller, Ithaca, NY (US);

Jonah deWall, Ithaca, NY (US);

Andrew Hocking, Ithaca, NY (US);

Kristin Lynch, Ithaca, NY (US);

Sangtae Park, Ithaca, NY (US);

Assignee:

KIONIX, INC., Ithaca, NY (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00269 (2013.01); B81C 2201/013 (2013.01); B81C 2201/0171 (2013.01); B81C 2201/0197 (2013.01); B81C 2201/05 (2013.01); B81C 2203/0118 (2013.01);
Abstract

A method of fabricating a semiconductor device, includes, in part, growing a first layer of oxide on a surface of a first semiconductor substrate, forming a layer of insulating material on the oxide layer, patterning and etching the insulating material and the first oxide layer to form a multitude of oxide-insulator structures and further to expose the surface of the semiconductor substrate, growing a second layer of oxide in the exposed surface of the semiconductor substrate, and removing the second layer of oxide thereby to form a cavity in which a MEMS device is formed. The process of growing oxide in the exposed surface of the cavity and removing this oxide may be repeated until the cavity depth reaches a predefined value. Optionally, a multitude of bump stops is formed in the cavity.


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