The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2019
Filed:
Feb. 01, 2016
Applicant:
Canon Kabushiki Kaisha, Tokyo, JP;
Inventors:
Shiro Sujaku, Kawasaki, JP;
Keiji Watanabe, Kawasaki, JP;
Kouji Hasegawa, Kawasaki, JP;
Junya Hayasaka, Funabashi, JP;
Satoshi Ibe, Yokohama, JP;
Assignee:
Canon Kabushiki Kaisha, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B41J 2/16 (2006.01); H01L 23/00 (2006.01); G01R 1/067 (2006.01); H01L 21/762 (2006.01); B23H 9/00 (2006.01);
U.S. Cl.
CPC ...
B41J 2/1631 (2013.01); B41J 2/1601 (2013.01); B41J 2/162 (2013.01); B41J 2/1623 (2013.01); H01L 24/13 (2013.01); B23H 9/008 (2013.01); G01R 1/06711 (2013.01); G01R 1/06755 (2013.01); G01R 1/06761 (2013.01); H01L 21/76232 (2013.01); Y10T 29/49004 (2015.01); Y10T 29/49147 (2015.01); Y10T 29/49401 (2015.01);
Abstract
A method for manufacturing a liquid-discharge-head substrate includes providing a substrate having an energy-generating element and a pad, the pad having a wiring layer and a contact-probe receiving section, the contact-probe receiving section having a Vickers hardness that is higher than a Vickers hardness of the wiring layer; bringing a contact probe into contact with the contact-probe receiving section; and performing an electrical inspection by bringing the contact probe into contact with the wiring layer in the pad.