The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2019
Filed:
Apr. 20, 2017
Jtekt Corporation, Osaka-shi, Osaka, JP;
Takahiro Yukimura, Kashiba, JP;
Noriaki Matsui, Kashihara, JP;
Akihiro Takeuchi, Kashiba, JP;
Hiroshi Kutsumi, Takarazuka, JP;
Shoichi Koyama, Yamatotakada, JP;
Fu Yao, Kashiba, JP;
Toshihiro Moriuchi, Kawachinagano, JP;
Kensaku Hotta, Kashihara, JP;
Satoshi Haraguchi, Kyoto, JP;
Yuki Kosumi, Kashiba, JP;
Masafumi Kajitani, Kashiba, JP;
JTEKT CORPORATION, Osaka-shi, JP;
Abstract
A mold for insert molding, which houses an electronic unit including a first circuit portion and a second circuit portion protruding from the first circuit portion, is prepared. The mold includes an upper wall surface facing an upper surface of the second circuit portion and side wall surfaces facing side surfaces of the second circuit portion. The flow resistance of a resin flowing through a space between each side surface of the second circuit portion and the corresponding side wall surface is lower than that of the resin flowing through a space between the upper surface of the second circuit portion and the upper wall surface. Then, the electronic unit is placed in the mold. Then, the resin is injected into the mold in which the electronic unit has been placed. Thus, the electronic unit and the housing in which the electronic unit is housed are integrated with each other.