The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 01, 2019
Filed:
Jul. 16, 2012
Applicants:
Seh Kwang Lee, Gyeonggi-do, KR;
Joo Han Lee, Gyeonggi-do, KR;
Inventors:
Seh Kwang Lee, Gyeonggi-do, KR;
Joo Han Lee, Gyeonggi-do, KR;
Assignee:
EHWA DIAMOND INDUSTRIAL CO., LTD., Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B24B 53/017 (2012.01); B24B 53/12 (2006.01);
U.S. Cl.
CPC ...
B24B 53/017 (2013.01); B24B 53/12 (2013.01);
Abstract
The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the cutting tip patterns have an improved structure that can increase the productivity of the CMP pad conditioner and that can sufficiently ensure the strength and safety of the cutting tip patterns.