The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Dec. 19, 2013
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Katsuhiko Itoh, Yamanashi, JP;

Daisuke Nagai, Yamanashi, JP;

Mitsuo Nakamura, Yamanashi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); H05K 13/00 (2006.01); H05K 13/04 (2006.01); B23K 1/008 (2006.01); B23K 3/06 (2006.01); B23K 3/08 (2006.01); H05K 13/08 (2006.01); B23K 101/42 (2006.01);
U.S. Cl.
CPC ...
H05K 13/0465 (2013.01); B23K 1/008 (2013.01); B23K 1/0016 (2013.01); B23K 3/0638 (2013.01); B23K 3/087 (2013.01); H05K 13/083 (2018.08); H05K 13/0817 (2018.08); B23K 2101/42 (2018.08); Y10S 901/02 (2013.01); Y10S 901/09 (2013.01);
Abstract

An electronic component mounting system includes: a printing apparatus; an electronic component mounting apparatus; and a mounting information storage unit which stores mounting information. The mounting information includes execution mode information in which one of a first mounting mode and a second mounting mode is set for each of electronic components. In the first mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a first recognition mark formed on a board. In the second mounting mode, the electronic component is placed at a mounting position corrected on the basis of a recognition result of a second recognition mark formed by paste printed on the board. The electronic components are mounted on the board according to mounting modes set for the respective electronic components by referring to the mounting information.


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