The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Apr. 27, 2018
Applicants:

Martin Brokner Christiansen, Laurel, MD (US);

Bruce Ryan Isler, Cantonsville, MD (US);

Jonathan Francis Van Dyke, Baltimore, MD (US);

Robert J. Voigt, Arnold, MD (US);

Benjamin Chaoning Liu, Silver Spring, MD (US);

Inventors:

Martin Brokner Christiansen, Laurel, MD (US);

Bruce Ryan Isler, Cantonsville, MD (US);

Jonathan Francis Van Dyke, Baltimore, MD (US);

Robert J. Voigt, Arnold, MD (US);

Benjamin Chaoning Liu, Silver Spring, MD (US);

Assignee:

Northrop Grumman Systems Corporation, Falls Church, VA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G06F 1/16 (2006.01); H05K 5/00 (2006.01); H05K 7/00 (2006.01); H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20236 (2013.01); H05K 7/20263 (2013.01); H05K 7/20272 (2013.01); H05K 7/20872 (2013.01);
Abstract

An apparatus for providing immersion cooling in a compact-format circuit card environment comprises a plurality of circuit cards. A plurality of thermal energy transfer devices is provided, each thermal energy transfer device at least partially inducing a respective one of first and second operating temperatures to a corresponding circuit card subassembly. At least one first temperature cooling manifold is in selective fluid communication with at least one first operating temperature thermal energy transfer device. At least one second temperature cooling manifold is in selective fluid communication with at least one second operating temperature thermal energy transfer device. A plurality of manifold interfaces is provided, each manifold interface being in fluid communication with a corresponding thermal energy transfer device. A housing includes first and second operating fluid inlets in fluid communication with first and second operating fluid outlets, respectively.


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