The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Jan. 28, 2015
Applicant:

Hewlett-packard Development Company, L.p., Houston, TX (US);

Inventors:

Chalam Kashyap, Fort Collins, CO (US);

Kuan-Ting Wu, Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 3/02 (2006.01); H05K 5/04 (2006.01); C23C 28/00 (2006.01); C25D 13/12 (2006.01); C25D 11/02 (2006.01); C25D 11/04 (2006.01); C25D 11/18 (2006.01); C25D 11/26 (2006.01); C25D 11/30 (2006.01); C25D 11/34 (2006.01); C25D 13/20 (2006.01);
U.S. Cl.
CPC ...
H05K 5/04 (2013.01); C23C 28/00 (2013.01); C23C 28/345 (2013.01); C25D 11/026 (2013.01); C25D 11/04 (2013.01); C25D 11/18 (2013.01); C25D 11/26 (2013.01); C25D 11/30 (2013.01); C25D 11/34 (2013.01); C25D 13/12 (2013.01); C25D 13/20 (2013.01);
Abstract

One example provides a method of manufacturing. The method comprises oxidizing, using plasma, a first surface of a substrate comprising a metal-material. The method further comprises cutting into the substrate through the oxidized first surface to expose a non-oxidized second surface of the substrate, the second surface not parallel to the first surface. The method further comprises disposing, using electrophoretic deposition, a coating layer over the exposed second surface to form an article having the oxidized first surface and the coated second surface.


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