The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Apr. 25, 2016
Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Sheng-Po Wang, Taoyuan, TW;

Heng-Yin Chen, Hsinchu County, TW;

Cheng-Chung Lee, Hsinchu, TW;

Jia-Chong Ho, Hsinchu County, TW;

Yung-Hui Yeh, Hsinchu, TW;

Tai-Jui Wang, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/18 (2006.01); H05K 3/00 (2006.01); H05K 3/46 (2006.01); H01L 23/498 (2006.01); H05K 3/42 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H05K 1/189 (2013.01); H01L 23/49827 (2013.01); H05K 3/007 (2013.01); H05K 3/429 (2013.01); H05K 3/4644 (2013.01); H05K 3/4682 (2013.01); H05K 1/144 (2013.01); H05K 2201/10128 (2013.01);
Abstract

A flexible electronic device including a first flexible substrate, an electronic component, and a control device is provided. The electronic component includes a conductive layer. The control device includes at least one integrated circuit and a circuit layer set. The circuit layer set includes a plurality of circuit layers and at least one first dielectric layer, and at least a portion of the first dielectric layer is interposed between two adjacent circuit layers. The integrated circuit is electrically connected to the electronic component through the circuit layer set and the conductive layer. At least a portion of the conductive layer and at least a portion of one circuit layer are integrally formed, and the conductive layer and the circuit layer are both disposed on the first flexible substrate. A fabricating method of a flexible electronic device is also provided.


Find Patent Forward Citations

Loading…