The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Jul. 29, 2015
Applicant:

Micronas Gmbh, Freiburg, DE;

Inventors:

Joerg Franke, Freiburg, DE;

Klaus Heberle, Emmendingen, DE;

Oliver Breitwieser, Gundelfingen, DE;

Timo Kaufmann, Waldkirch-Suggental, DE;

Assignee:

TDK-Micronas GmbH, Freiburg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H05K 1/18 (2006.01); G01R 33/00 (2006.01); G01R 1/04 (2006.01);
U.S. Cl.
CPC ...
H05K 1/18 (2013.01); G01R 33/00 (2013.01); G01R 1/04 (2013.01); H05K 2201/083 (2013.01);
Abstract

An electrical component having a first package part of a first plastic compound. The first package part has a first trench-shaped formation. A first semiconductor body with an integrated circuit is disposed in the first trench-shaped formation. At least two traces, which run on an outer side of the first package part, are provided on a surface of the first trench-shaped formation, wherein the at least two traces are connected to the integrated circuit. The first trench-shaped formation is filled at least partially with a filling material of a second plastic compound to cover the first semiconductor body.


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