The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Jan. 04, 2018
Applicants:
Inventec (Pudong) Technology Corporation, Shanghai, CN;
Inventec Corporation, Taipei, TW;
Inventors:
Chih-Cheng Li, Taipei, TW;
Yung-Chin Hsieh, Taipei, TW;
Assignees:
INVENTEC (PUDONG) TECHNOLOGY CORPORATION, Shanghai, CN;
INVENTEC CORPORATION, Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H01Q 15/00 (2006.01); H01P 1/20 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0236 (2013.01); H01P 1/2005 (2013.01); H01Q 15/006 (2013.01); H01L 2224/16225 (2013.01); H05K 1/0237 (2013.01); H05K 3/4602 (2013.01); H05K 3/4611 (2013.01); H05K 3/4652 (2013.01); H05K 2201/09309 (2013.01);
Abstract
A circuit board includes a dielectric layer, a conductive layer disposed on a surface of the dielectric layer, and an electromagnetic bandgap (EBG) structure disposed in the dielectric layer. The electromagnetic bandgap structure includes a via and a signal suppression board. Two opposite ends of the via are respectively connected to the electrically conductive layer and the signal suppression board respectively. The signal suppression board has at least one hollow pattern.