The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Mar. 14, 2018
Applicant:

Microsoft Technology Licensing, Llc, Redmond, WA (US);

Inventors:

Martin B. Christiansen, Ellicott City, MD (US);

Stanley K. Wakamiya, Ellicott City, MD (US);

Leonard G. Chorosinski, Ellicott City, MD (US);

Harlan C. Heffner, Ellicott City, MD (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 5/00 (2006.01); H05K 1/02 (2006.01); G06F 1/18 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0201 (2013.01); G06F 1/182 (2013.01); H05K 1/181 (2013.01); H05K 2201/062 (2013.01); H05K 2201/10159 (2013.01);
Abstract

A computing system including a common substrate having both superconducting components and non-superconducting components is provided. The superconducting components may be attached towards a first end of the common substrate and the non-superconducting components may be attached towards a second end, opposite to the first end, of the common substrate. The common substrate may include circuit traces for interconnecting the superconducting components with the non-superconducting components. A heat-shield may thermally separate the first end from the second end of the common substrate such that the superconducting components are configured to operate in a temperature range between 2 Kelvin to 77 Kelvin and the non-superconducting components are configured to operate in a temperature range between 200 Kelvin to 400 Kelvin. Each of the superconducting components may be configured to provide primarily a processor functionality and each of the non-superconducting components may be configured to provide primarily a storage functionality.


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