The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Jun. 05, 2017
Applicant:
Skyworks Solutions, Inc., Woburn, MA (US);
Inventors:
Ambarish Roy, Waltham, MA (US);
Nuttapong Srirattana, Billerica, MA (US);
Assignee:
SKYWORKS SOLUTIONS, INC., Woburn, MA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H04B 1/525 (2015.01); G06F 1/18 (2006.01); H01L 23/538 (2006.01); H01L 23/66 (2006.01); H01L 23/522 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H04B 1/525 (2013.01); G06F 1/182 (2013.01); H01L 23/5225 (2013.01); H01L 23/5385 (2013.01); H01L 23/552 (2013.01); H01L 23/66 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2223/6611 (2013.01); H01L 2223/6655 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/05554 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/48227 (2013.01); H01L 2924/19105 (2013.01);
Abstract
A semiconductor die comprises a first active device, at least one of a second active device and a passive component, and electromagnetic shielding configured to at least partially electromagnetically isolate the first active device from the at least one of the second active device and the passive component. The electromagnetic shielding includes one of a grounded metal layer and via stack, and a grounded metal layer disposed one of above and below the first active device.