The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Apr. 21, 2015
Applicants:

Autonetworks Technologies, Ltd., Yokkaichi, Mie, JP;

Sumitomo Wiring Systems, Ltd., Suzuka, JP;

Sumitomo Electric Industries, Ltd., Osaka, JP;

Inventors:

Takehito Kobayashi, Mie, JP;

Yoshikazu Sasaki, Mie, JP;

Shigeki Yamane, Mie, JP;

Yukinori Kita, Mie, JP;

Tomohiro Ooi, Mie, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F23Q 7/00 (2006.01); H02G 3/16 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/18 (2006.01); H05K 5/00 (2006.01);
U.S. Cl.
CPC ...
H02G 3/16 (2013.01); H05K 1/0203 (2013.01); H05K 1/115 (2013.01); H05K 1/117 (2013.01); H05K 1/181 (2013.01); H05K 5/0069 (2013.01); H05K 2201/10272 (2013.01);
Abstract

Provided is a circuit assembly that includes: a circuit board that has a connection opening; a plurality of busbars that are laid on one surface side of the circuit board; a coil that includes a main portion and a plurality of lead terminals, the lead terminals being connected to the plurality of busbars exposed through the connection opening; and a heatsink that is laid, via an adhesive agent, on surfaces of the plurality of busbars that face away from the circuit board. The circuit board is provided with a substrate through-hole in the vicinity of the connection opening, and the plurality of busbars are provided with a busbar through-hole at the position that corresponds to the substrate through-hole.


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