The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Feb. 22, 2017
Applicant:

Stanley Electric Co., Ltd., Meguro-ku, Tokyo, JP;

Inventors:

Philip Rackow, Yokohama, JP;

Yusuke Yokobayashi, Yokohama, JP;

Keijiro Takashima, Yokohama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01S 5/32 (2006.01); H01S 5/22 (2006.01); H01S 5/042 (2006.01); H01S 5/24 (2006.01); H01S 5/02 (2006.01); H01S 5/323 (2006.01);
U.S. Cl.
CPC ...
H01S 5/3202 (2013.01); H01S 5/0202 (2013.01); H01S 5/0425 (2013.01); H01S 5/2202 (2013.01); H01S 5/24 (2013.01); H01S 5/0203 (2013.01); H01S 5/2201 (2013.01); H01S 5/32341 (2013.01);
Abstract

A method for manufacturing a semiconductor light-emitting device includes: forming a plurality of guide grooves so as to be depressed from a surface of a semiconductor structure layer toward a semiconductor substrate and to align and extend along a direction perpendicular to an extending direction of a plurality of line electrodes; forming, in each of the plurality of guide grooves, a scribe groove so as to be depressed from a bottom surface of the guide groove toward the semiconductor substrate and to extend along an extending direction of the guide groove; and dividing a semiconductor wafer along the plurality of guide grooves. The guide groove and the scribe groove are formed to have end shapes in such a manner that inner walls thereof project toward each other in the extending direction of the scribe groove.


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