The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Sep. 20, 2017
Applicant:

Seiko Epson Corporation, Tokyo, JP;

Inventor:

Tetsuo Shimizu, Matsumoto-shi, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03B 21/14 (2006.01); H04N 9/31 (2006.01); H01S 3/08 (2006.01); G03B 21/20 (2006.01); F21V 9/30 (2018.01); H01S 5/00 (2006.01); H01S 5/323 (2006.01); H01S 5/40 (2006.01);
U.S. Cl.
CPC ...
H01S 3/08004 (2013.01); F21V 9/30 (2018.02); G03B 21/204 (2013.01); H01S 5/005 (2013.01); H04N 9/3102 (2013.01); H04N 9/3161 (2013.01); H01S 5/0071 (2013.01); H01S 5/32341 (2013.01); H01S 5/4025 (2013.01);
Abstract

A wavelength conversion element includes a substrate; a wavelength conversion portion that converts incident light of a first wavelength into light of a second wavelength different from the light of the first wavelength; and a bonding material that bonds the substrate and the wavelength conversion portion. The wavelength conversion portion includes a first surface on which the light of the first wavelength is incident, and a second surface that is positioned on a side opposite to the first surface. The bonding material bonds the substrate and the second surface of the wavelength conversion portion, and forms a bonding region inside the second surface. The wavelength conversion portion is configured such that an irradiation region irradiated with the light of the first wavelength is set on the first surface inside the bonding region.


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