The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Sep. 30, 2016
Applicant:

Western Digital Technologies, Inc., Irvine, CA (US);

Inventors:

Kyosuke Yoshida, Yokohama, JP;

Kimihiko Sudo, Yokohama, JP;

Takako Hayakawa, Hiratsuka, JP;

Hajime Eguchi, Fujisawa, JP;

Yuta Onobu, Yokoyama, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 33/12 (2006.01); H01R 12/59 (2011.01); H01R 12/71 (2011.01); H05K 3/30 (2006.01); H01R 12/79 (2011.01); H05K 3/34 (2006.01); H01R 12/75 (2011.01); G11B 33/02 (2006.01); H01R 13/05 (2006.01); H01R 13/24 (2006.01); G11B 25/04 (2006.01); H05K 5/06 (2006.01); H01R 12/77 (2011.01);
U.S. Cl.
CPC ...
H01R 12/59 (2013.01); G11B 25/043 (2013.01); G11B 33/02 (2013.01); G11B 33/122 (2013.01); H01R 12/71 (2013.01); H01R 12/716 (2013.01); H01R 12/75 (2013.01); H01R 12/79 (2013.01); H01R 13/05 (2013.01); H01R 13/2471 (2013.01); H01R 13/2485 (2013.01); H05K 3/308 (2013.01); H05K 3/34 (2013.01); H05K 3/3415 (2013.01); H05K 5/069 (2013.01); H01R 12/777 (2013.01); H01R 2201/06 (2013.01);
Abstract

An electrical feed-through assembly includes electrically conductive pins having a top apex and a bottom apex, where the pins extend through at least a majority of an electrically non-conductive material. The top apexes, the bottom apexes, or both the top and bottom apexes of the pins have an electrically conductive connection pad material, such as a solder pad, coupled thereto. In variations, the top and/or bottom apexes may be slightly recessed from a corresponding surface of the non-conductive material, such that the connection pads fill the respective recesses; and/or the top and/or bottom apexes barely extend from a corresponding surface, such that the connection pads bulge out from the corresponding surface. Such a feed-through configuration may inhibit pin bending, in addition to enabling use of more types of connectors beyond pin-and-socket type connectors.


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