The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Jul. 27, 2017
Applicant:

Bellwether Electronic Corp, Taoyuan, TW;

Inventors:

Hsing-Yu Lee, Taoyuan, TW;

Hung-Yu Chen, New Taipei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 7/08 (2006.01); H01P 3/02 (2006.01); H01B 3/44 (2006.01); H01B 7/02 (2006.01); H01B 7/04 (2006.01); H01B 11/00 (2006.01); H05K 9/00 (2006.01); H01P 3/06 (2006.01); H01B 7/17 (2006.01);
U.S. Cl.
CPC ...
H01P 3/02 (2013.01); H01B 3/441 (2013.01); H01B 7/0216 (2013.01); H01B 7/04 (2013.01); H01B 7/0823 (2013.01); H01B 7/0861 (2013.01); H01B 11/00 (2013.01); H01P 3/06 (2013.01); H05K 9/0084 (2013.01); H01B 7/17 (2013.01);
Abstract

The instant disclosure relates to a high frequency signal transmission device which includes an insulation cover, at least one flexible flat cable, and an electrical connector assembly. The insulation cover has an accommodation space, the at least one flexible flat cable is disposed in the accommodation space, and the electrical connector assembly is electrically connected to one end of the at least one flexible flat cable. The at least one flexible flat cable includes a plurality of conductors, an insulation layer, a polyolefin resin layer, and a shielding layer. The insulation layer is laminated over the conductors. The polyolefin resin layer is attached to the insulation layer by a first low-k dielectric adhesive layer, and the shielding layer is attached to the polyolefin resin layer by another first low-k dielectric adhesive layer.


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