The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Sep. 18, 2015
Applicant:
Boe Technology Group Co., Ltd, Beijing, CN;
Inventors:
Assignee:
BOE TECHNOLOGY GROUP CO., LTD., Beijing, CN;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 27/00 (2006.01); H01L 51/52 (2006.01); H01L 21/77 (2017.01); H01L 25/16 (2006.01); H01L 25/00 (2006.01); H01L 51/56 (2006.01); H01L 29/786 (2006.01); H01L 27/32 (2006.01); H01L 23/544 (2006.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5253 (2013.01); H01L 21/77 (2013.01); H01L 25/167 (2013.01); H01L 25/50 (2013.01); H01L 29/78603 (2013.01); H01L 51/56 (2013.01); H01L 21/6835 (2013.01); H01L 23/544 (2013.01); H01L 27/3276 (2013.01); H01L 51/524 (2013.01); H01L 2221/6835 (2013.01); H01L 2223/54473 (2013.01); H01L 2223/54486 (2013.01); H01L 2227/326 (2013.01); H01L 2251/5338 (2013.01);
Abstract
The present disclosure provides a method for bonding an integrated circuit (IC) chip onto a flexible display body. The method includes providing a substrate having a flexible display body thereon, and aligning a first stiffening component with the flexible display body having an IC bonding region. The method further includes attaching the first stiffening component onto a front surface of the flexible display body, and separating the substrate from the first stiffening component and the flexible display body to expose a back surface of the flexible display body; and bonding an IC chip onto the IC bonding region.