The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Aug. 31, 2017
Applicant:

Nichia Corporation, Anan-shi, Tokushima, JP;

Inventors:

Masato Fujitomo, Yokohama, JP;

Hiroto Tamaki, Anan, JP;

Shinji Nishijima, Anan, JP;

Yuichiro Tanda, Tokyo, JP;

Tomohide Miki, Tokushima, JP;

Assignee:

Nichia Corporation, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 23/00 (2006.01); H01L 31/0203 (2014.01); H01L 31/02 (2006.01); H01L 33/52 (2010.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 33/62 (2013.01); H01L 24/97 (2013.01); H01L 31/02002 (2013.01); H01L 31/0203 (2013.01); H01L 33/486 (2013.01); H01L 33/52 (2013.01); H01L 25/167 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/97 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01012 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/12042 (2013.01); H01L 2924/12043 (2013.01); H01L 2924/12044 (2013.01); H01L 2924/14 (2013.01); H01L 2924/181 (2013.01); H01L 2924/1815 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.


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