The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Oct. 20, 2015
Applicant:

Koninklijke Philips N.v., Eindhoven, NL;

Inventors:
Assignee:

Koninklijke Philips N.V., Eindhoven, NL;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/60 (2010.01); H01L 33/50 (2010.01); H01L 27/15 (2006.01); H01L 33/46 (2010.01); H01L 33/58 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/60 (2013.01); H01L 27/156 (2013.01); H01L 33/46 (2013.01); H01L 33/502 (2013.01); H01L 33/507 (2013.01); H01L 33/58 (2013.01); H01L 33/486 (2013.01); H01L 2933/0033 (2013.01); H01L 2933/0041 (2013.01); H01L 2933/0058 (2013.01);
Abstract

A light emitting arrangement is suggested for generating directional projections of light with sharply defined beam profile. Light from a top-emitting solid state light source (), having reflective side-coating (), is pre-collimated via a beam-shaping optic (), before being propagated through a secondary collimating funnel (), capturing any light rays with still too great an escape angle. Chip-scale package dimensions may be achieved through the use of a thin-film side-coating and undersized phosphor layers. Substrate level process flow further allows for parallel processing of a plurality of devices.


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