The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Jul. 27, 2017
Applicant:

Osram Opto Semiconductors Gmbh, Regensburg, DE;

Inventors:

Karl Engl, Pentling, DE;

Markus Maute, Alteglofsheim, DE;

Stefanie Rammelsberger, Zeitlarn, DE;

Anna Kasprzak-Zablocka, Donaustauf, DE;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/36 (2010.01); H01L 33/00 (2010.01); H01L 33/40 (2010.01); H01L 33/52 (2010.01); H01L 33/38 (2010.01);
U.S. Cl.
CPC ...
H01L 33/0075 (2013.01); H01L 33/382 (2013.01); H01L 33/405 (2013.01); H01L 33/52 (2013.01); H01L 33/385 (2013.01); H01L 2933/005 (2013.01);
Abstract

An optoelectronic semiconductor chip has a semiconductor body and a substrate on which the semiconductor body is disposed. The semiconductor body has an active region disposed between a first semiconductor layer of a first conductor type and a second semiconductor layer of a second conductor type. The first semiconductor layer is disposed on the side of the active region facing the substrate. The first semiconductor layer is electrically conductively connected to a first termination layer that is disposed between the substrate and the semiconductor body. An encapsulation layer is disposed between the first termination layer and the substrate and, in plan view of the semiconductor chip, projects at least in some regions over a side face which delimits the semiconductor body.


Find Patent Forward Citations

Loading…