The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Oct. 07, 2015
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, Kanagawa, JP;

Inventors:

Masafumi Horio, Matsumoto, JP;

Yoshinari Ikeda, Matsumoto, JP;

Hideyo Nakamura, Matsumoto, JP;

Hayato Nakano, Kofu, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/07 (2006.01); H01L 23/492 (2006.01); H01L 23/498 (2006.01); H01L 23/64 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01); H01L 25/18 (2006.01); H01L 23/12 (2006.01); H01L 29/739 (2006.01); H01L 29/78 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/072 (2013.01); H01L 23/12 (2013.01); H01L 23/3121 (2013.01); H01L 23/3735 (2013.01); H01L 23/492 (2013.01); H01L 23/49811 (2013.01); H01L 23/49838 (2013.01); H01L 23/64 (2013.01); H01L 24/01 (2013.01); H01L 24/32 (2013.01); H01L 25/18 (2013.01); H01L 29/7395 (2013.01); H01L 29/7827 (2013.01); H01L 23/3107 (2013.01); H01L 24/06 (2013.01); H01L 2224/06181 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48139 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/1203 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01); H01L 2924/15787 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3011 (2013.01);
Abstract

A semiconductor device includes an insulating substrate having an insulating plate and a circuit plate; a semiconductor chip having a front surface provided with a gate electrode and a source electrode, and a rear surface fixed to the circuit plate; a printed circuit board facing the insulating substrate, and including a first metal layer and a second metal layer; a first conductive post having two ends electrically and mechanically connected to the gate electrode and the first metal layer; a second conductive post having two ends electrically and mechanically connected to the source electrode and the second metal layer; and a circuit impedance reducing element electrically connected between the gate electrode and the source electrode through the first conductive post and the second conductive post.


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