The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Feb. 16, 2016
Rohm Co., Ltd., Kyoto, JP;
Hideaki Yanagida, Kyoto, JP;
ROHM CO., LTD., Kyoto, JP;
Abstract
The present disclosure provides an electronic device suitable for miniaturization. The present electronic device includes: a substrate (), having a main surface () and a back surface () facing opposite sides with each other in a thickness direction, wherein the substrate comprises a semiconductor material; an electronic component (), which is disposed over the substrate (); and a conductive layer (), which is electrically connected with the electronic component (); wherein a recess for disposing the component () and a through recess () are formed in the substrate, in which recess for disposing the component () is recessed from the main surface (), and the through recess () penetrates from the recess for disposing the component () to the back surface (); the electronic component () is disposed over the recess for disposing the component (); a metal-filled portion () is formed in the through recess (), wherein the metal-filled portion blocks at least the bottom of the through recess () and is filled with a metal material; and the conductive layer () is formed at least from the through recess () to the back surface ().