The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Jun. 23, 2017
Applicant:
Infineon Technologies Ag, Neubiberg, DE;
Inventors:
Friedrich Rasbornig, Klagenfurt, AT;
Wolfgang Granig, Seeboden, AT;
Dirk Hammerschmidt, Finkerstein, AT;
Hans-Joerg Wagner, Villach, AT;
Thomas Zettler, Hoehenkirchen-Siegertsbrunn, DE;
Assignee:
Infineon Technologies AG, Neubiberg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 23/5386 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01);
Abstract
An integrated circuit package having a first die configured to sense a first physical characteristic and provide a first data signal, and a second die, wherein the first die is configured to transmit the first data signal to the second die, and the second die is configured to determine if there is an error in the first die and transmit the result to a controller.