The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Apr. 28, 2016
Applicant:

Fuji Electric Co., Ltd., Kawasaki-shi, JP;

Inventor:

Kousuke Komatsu, Matsumoto, JP;

Assignee:

FUJI ELECTRIC CO., LTD., Kawasaki-Shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 23/373 (2006.01); H01L 23/047 (2006.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/047 (2013.01); H01L 23/3737 (2013.01); H01L 23/24 (2013.01); H01L 2224/32225 (2013.01); H01L 2924/181 (2013.01); H01L 2924/19107 (2013.01);
Abstract

There is provided a semiconductor device provided with a metal base, a frame-shaped resin case adhered to the metal base, a semiconductor chip having a main electrode and being disposed inside the resin case, a main terminal having an internal end which is electrically connected to the main electrode of the semiconductor chip, integrally fixed to the resin case, and exposed inside the resin case and an external end exposed outside the resin case, a heat dissipation member which is placed, in contact with the metal base, between the metal base and the internal end of the main terminal, and has higher thermal conductivity than that of the resin case.


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