The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Aug. 15, 2017
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-Do, KR;
Young-Ho Kim, Hwaseong-si, KR;
Ho-Sung Song, Soul, KR;
Jeong-Sik Nam, Seoul, KR;
Kyoung-Min Kim, Namyangju-si, KR;
Tae-Hyeong Lee, Chungcheongnam, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
A semiconductor device structure, including integrated circuits of semiconductor chips and scribe lanes between the regions in which the circuits have been formed, has at least one redistribution pad disposed in one of the scribe lanes for simultaneously testing a group of the integrated circuits, and a metal interconnection structure disposed beneath the redistribution pad(s). The metal interconnection structure includes at least conductive via contacting the redistribution pad at the bottom of the pad. The conductive via(s) is/are arranged so that at least a portion of each via remains attached to the redistribution pad when the structure is sawed along the scribe lane.