The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Sep. 22, 2015
Applicant:
Qualcomm Incorporated, San Diego, CA (US);
Inventors:
David Fraser Rae, San Diego, CA (US);
Lizabeth Ann Keser, San Diego, CA (US);
Reynante Tamunan Alvarado, San Diego, CA (US);
Assignee:
QUALCOMM Incorporated, San Diego, CA (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 25/16 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/768 (2013.01); H01L 21/563 (2013.01); H01L 23/3128 (2013.01); H01L 23/5384 (2013.01); H01L 23/5385 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 25/16 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 23/49816 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/24137 (2013.01); H01L 2224/24195 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/97 (2013.01); H01L 2225/1035 (2013.01); H01L 2225/1041 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/1434 (2013.01); H01L 2924/18162 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/37001 (2013.01);
Abstract
A package may include a die proximate to a structure having a substrate with interconnects and a first component coupled to the interconnects. The die may be face up or face down. The package may include a first redistribution layer coupling the die to the interconnects of the structure and a mold compound covering the die and maybe the structure.