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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10163674 B1

PDFFull Text
Date of Patent:
Dec. 25, 2018

Filed:

Nov. 24, 2015

Circular support substrate for semiconductor

Applicant:

National Institute of Advanced Industrial Science and Technology, Chiyoda-ku, Tokyo, JP;

Inventors:

Shiro Hara, Tsukuba, JP;

Sommawan Khumpuang, Tsukuba, JP;

Fumito Imura, Tsukuba, JP;

Michihiro Inoue, Tosu, JP;

Arami Saruwatari, Tosu, JP;

Assignee:

NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY, Tokyo, JP;

Attorney:

Law Office of Katsuhiro Arai

Primary Examiner:

Bryan R Junge

Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 21/683 (2006.01); H01L 21/02 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); H01L 21/02 (2013.01); H01L 21/565 (2013.01); H01L 21/683 (2013.01); H01L 23/3114 (2013.01); H01L 23/544 (2013.01); H01L 24/02 (2013.01); H01L 21/568 (2013.01); H01L 24/03 (2013.01); H01L 24/05 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 2221/68309 (2013.01); H01L 2221/68372 (2013.01); H01L 2223/54426 (2013.01); H01L 2224/0239 (2013.01); H01L 2224/02311 (2013.01); H01L 2224/02313 (2013.01); H01L 2224/02377 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/03002 (2013.01); H01L 2224/0361 (2013.01); H01L 2224/0391 (2013.01); H01L 2224/03462 (2013.01); H01L 2224/03622 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/05548 (2013.01); H01L 2224/11002 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11849 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/13022 (2013.01); H01L 2224/13024 (2013.01); H01L 2224/94 (2013.01); H01L 2924/01029 (2013.01);
Abstract

An object of the present invention is to provide a circular support substrate that allows for positioning based solely on its outer periphery shape. As a means for solving the problems, a circular support substrate is provided that has at least three chords along its circumference, wherein the chords are provided at positions where they do not run linearly symmetrical to the straight line passing through the center axis of the circular support substrate.

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Hara, Shiro. (2018). Circular support substrate for semiconductor (U.S. Patent No. 10163674). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10163674

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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