The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Feb. 25, 2016
Applicant:

Techest. Co., Ltd, Anseong-si, Gyeonggi-do, KR;

Inventors:

Min Jin Han, Osan-si, KR;

Jae Geon Kim, Osan-si, KR;

Assignee:

TECHEST CO., LTD., Anseong-si, Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
F25B 21/02 (2006.01); H01L 21/67 (2006.01); H01L 21/683 (2006.01); F28F 27/02 (2006.01);
U.S. Cl.
CPC ...
H01L 21/67109 (2013.01); F25B 21/02 (2013.01); F28F 27/02 (2013.01); H01L 21/67248 (2013.01); H01L 21/6831 (2013.01); F25B 2321/021 (2013.01);
Abstract

Provided is a temperature control system configured to mix a low temperature heating medium and a high temperature heating medium to supply the heating mediums at a temperature according to a process recipe to an electrostatic chuck (ESC) configured to maintain a temperature and support a wafer in a chamber in which a semiconductor wafer processing process is performed, and a heating medium obtained by mixing a heating medium cooled through a thermoelectric element and a heating medium heated through a heater to a desired target temperature according to a first ratio and a second ratio is provided to a load and recovered from the load, and the heating medium is distributed to the thermoelectric element and the heater according to the first ratio and the second ratio, which are ratios upon the mixing, optimizing power consumption for cooling or heating.


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