The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Feb. 16, 2016
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Ranga Rao Arnepalli, Krishna, IN;

Nilesh Chimanrao Bagul, Bangalore, IN;

Prerna Sonthalia Goradia, Mumbai, IN;

Robert Jan Visser, Menlo Park, CA (US);

Assignee:

APPLIED MATERIALS, INC., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/448 (2006.01); H01L 21/3065 (2006.01); C23C 16/04 (2006.01); C23C 16/455 (2006.01); H01L 21/306 (2006.01); H01L 21/32 (2006.01); H01L 21/465 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0262 (2013.01); C23C 16/045 (2013.01); C23C 16/4486 (2013.01); C23C 16/45525 (2013.01); H01L 21/0228 (2013.01); H01L 21/02107 (2013.01); H01L 21/30621 (2013.01); H01L 21/32 (2013.01); H01L 21/465 (2013.01); H01L 21/02521 (2013.01);
Abstract

Systems and methods for processing films on the surface of a substrate are described. The systems possess aerosol generators which form droplets from a condensed matter (liquid or solid) of one or more precursors. A carrier gas is flowed through the condensed matter and push the droplets toward a substrate placed in a substrate processing region. An inline pump connected with the aerosol generator can also be used to push the droplets towards the substrate. A direct current (DC) electric field is applied between two conducting plates configured to pass the droplets in-between. The size of the droplets is desirably reduced by application of the DC electric field. After passing through the DC electric field, the droplets pass into the substrate processing region and chemically react with the substrate to deposit or etch films.


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