The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

May. 16, 2016
Applicant:

Toyota Jidosha Kabushiki Kaisha, Toyota-shi, Aichi-ken, JP;

Inventors:

Yasuyuki Hirao, Okazaki, JP;

Hideki Manabe, Toyota, JP;

Assignee:

TOYOTA JIDOSHA KABUSHIKI KAISHA, Toyota-shi, Aichi-ken, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 43/00 (2006.01); H01B 13/06 (2006.01); H02K 3/14 (2006.01); H02K 15/04 (2006.01); H01B 13/02 (2006.01);
U.S. Cl.
CPC ...
H01B 13/06 (2013.01); H02K 3/14 (2013.01); H02K 15/0414 (2013.01); H01B 13/0292 (2013.01); Y10T 29/49117 (2015.01);
Abstract

A method of manufacturing a coated conducting wire assembly includes forming a conducting wire assembly by twist-deforming a conducting wire bundle, forming a coated conducting wire assembly by covering the conducting wire assembly with an insulation coating, and annealing the coated conducting wire assembly. The conducting wire bundle is formed by bundling a plurality of conducting wires. The conducting wire assembly includes a parallel portion, a left-wound portion, and a right-wound portion. The annealing is performed by heating and holding the coated conducting wire assembly at an annealing temperature while applying tension to the covered conducting wire assembly.


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