The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Aug. 11, 2017
Applicant:
SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;
Inventor:
Hyun Ju Yoon, Suwon-si, KR;
Assignee:
SK hynix Inc., Icheon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 7/04 (2006.01); G11C 7/06 (2006.01); G11C 7/10 (2006.01); G11C 7/16 (2006.01); G11C 11/406 (2006.01); G11C 11/4091 (2006.01); G11C 11/4093 (2006.01); G11C 5/06 (2006.01); G11C 5/04 (2006.01);
U.S. Cl.
CPC ...
G11C 7/04 (2013.01); G11C 5/04 (2013.01); G11C 5/06 (2013.01); G11C 7/06 (2013.01); G11C 7/10 (2013.01); G11C 7/16 (2013.01); G11C 11/4091 (2013.01); G11C 11/4093 (2013.01); G11C 11/40626 (2013.01);
Abstract
A memory module may be provided. The memory module may include a thermocouple and a temperature sensor. The thermocouple may be coupled to at least one contact point among a plurality of contact points formed on a region, on which a memory device may be configured to be mounted. The temperature sensor may be coupled to the thermocouple, and may be configured to generate temperature information.
Yoon, Hyun. (2018). Memory module capable of measuring temperature and system using the same (U.S. Patent No. 10163464). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10163464
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile