The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Jan. 02, 2017
Jilin University, Changchun, CN;
Junqi Sun, Changchun, CN;
Zilin Wang, Changchun, CN;
Xiang Li, Changchun, CN;
Yang Li, Changchun, CN;
JILIN UNIVERSITY, Changchun, CN;
Abstract
A method of preparing a water-based adhesive with high binding property based on polymer composites is provided, belonging to the technical field of preparation of water-based adhesives. The present invention specifically relates to a method of forming a polymer composite by blending solutions and then preparing the water-based adhesive with high binding property. The preparation method of the present invention is simple, obtaining the composite polymer hydrogel merely by blending solutions, with the dense water-based adhesive produced by centrifugation. This water-based adhesive is formed based on multiple weak interactions among the polymers, with the forming process simple and efficient and involving no sophisticated instruments and equipment; no organic solvent needs to be added in the preparation process, odor free, non-toxic and environment-protective, and common raw materials are used that are inexpensive. This water-based adhesive can be used for bonding glass, metal, wood, plastic and other various materials, and has high binding strength, allowing the materials (except plastic) to be bonded directly without surface pretreatment or modification. It is expected that the water-based adhesive prepared by the present invention will be applied in a wide range of fields.