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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10160637 B1

PDFFull Text
Date of Patent:
Dec. 25, 2018

Filed:

Aug. 29, 2014

Molded lead frame package with embedded die

Applicant:

Robert Bosch Gmbh, Stuttgart, DE;

Inventors:

Jay Scott Salmon, Pittsburgh, PA (US);

Uwe Hansen, Tubingen, DE;

Assignee:

Robert Bosch GmbH, Stuttgart, DE;

Attorney:

Michael Best & Friedrich LLP

Primary Examiner:

Kevin M Picardat

Int. Cl.
CPC ...
H01L 29/82 (2006.01); B81B 7/00 (2006.01); H01L 23/498 (2006.01); H04R 19/00 (2006.01); H04R 19/04 (2006.01); H04R 31/00 (2006.01); B81C 1/00 (2006.01); H01L 21/48 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
B81B 7/007 (2013.01); B81C 1/00238 (2013.01); H01L 21/4828 (2013.01); H01L 23/49541 (2013.01); H01L 23/49861 (2013.01); H04R 19/005 (2013.01); H04R 19/04 (2013.01); H04R 31/00 (2013.01); B81B 2201/0257 (2013.01); B81B 2207/012 (2013.01); B81B 2207/07 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/19107 (2013.01); H04R 2201/003 (2013.01);
Abstract

A semiconductor package. The semiconductor package includes a first side, a second side, a molded substrate, a die, and a lead frame. The second side of the semiconductor package is opposite the first side of the semiconductor package. The die and lead frame are embedded into the molded substrate. The lead frame is also positioned between the first side and the second side of the semiconductor package to provide a first electrical connection between the first side and the second side of the semiconductor package.

Find Patent Forward Citations

Salmon, Jay. (2018). Molded lead frame package with embedded die (U.S. Patent No. 10160637). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10160637

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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