The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 25, 2018
Filed:
Oct. 30, 2015
Applicant:
Mitsubishi Electric Corporation, Chiyoda-ku, JP;
Inventors:
Nobuaki Konno, Chiyoda-ku, JP;
Yoshiaki Hirata, Chiyoda-ku, JP;
Assignee:
Mitsubishi Electric Corporation, Chiyoda-ku, JP;
Primary Examiner:
Int. Cl.
CPC ...
B81B 7/00 (2006.01); B81B 7/02 (2006.01); H01L 23/02 (2006.01); H01L 23/04 (2006.01); H01L 23/08 (2006.01); H01L 23/12 (2006.01); H01L 25/00 (2006.01); H05K 3/46 (2006.01); B81C 1/00 (2006.01); H01L 23/15 (2006.01);
U.S. Cl.
CPC ...
B81B 7/0041 (2013.01); B81B 7/0077 (2013.01); B81B 7/02 (2013.01); B81C 1/00158 (2013.01); B81C 1/00293 (2013.01); H01L 23/02 (2013.01); H01L 23/04 (2013.01); H01L 23/08 (2013.01); H01L 23/12 (2013.01); H01L 23/15 (2013.01); H01L 25/00 (2013.01); H05K 3/46 (2013.01); B81B 2203/0315 (2013.01); B81B 2207/012 (2013.01); B81B 2207/092 (2013.01); B81B 2207/095 (2013.01); B81B 2207/096 (2013.01); B81C 2201/0197 (2013.01); B81C 2203/0109 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/031 (2013.01); B81C 2203/0785 (2013.01);
Abstract
A ceramic substrate is mainly constituted of ceramic, and has a first main surface and a second main surface located opposite to the first main surface. A recessed portion recessed toward a first main surface side is formed in the second main surface. A wire portion extending from an outer peripheral surface of the ceramic substrate to inside of the recessed portion is formed, and a bottom portion located on the first main surface side in the recessed portion has a portion thinner than another portion of the ceramic substrate other than the bottom portion.