The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Sep. 23, 2017
Applicants:

John Jerome Kusnierek, Springfield, OH (US);

Jeffrey Richard Dewispelaere, Elk River, MN (US);

Inventors:

John Jerome Kusnierek, Springfield, OH (US);

Jeffrey Richard DeWispelaere, Elk River, MN (US);

Assignee:

Other;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 1/00 (2006.01); B23K 1/018 (2006.01); B23K 3/06 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 3/0607 (2013.01); B23K 1/0016 (2013.01); B23K 2101/40 (2018.08);
Abstract

One embodiment of a robust process for the repair of a solder bridge defect in a Surface Mount Technology micro-electronic circuit assembly with fine pitch components. The defective solder joint is heated by various means and a cold gas jet blast is applied to the defective solder joint. An effect is created whereby the solder inducing the defect is conveyed away by the impact of the cold gas jet blast. The advantages of this embodiment include scalability for pin spacing and elimination of heat induced latent defects. The process is applicable to any pin spacing, but is of particular usefulness with pin spacing of 0.025 inch or finer. Other embodiments are described and shown.


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