The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 25, 2018

Filed:

Aug. 19, 2015
Applicant:

Asahi Kasei Kabushiki Kaisha, Tokyo, JP;

Inventors:

Kohei Nakamoto, Tokyo, JP;

Naoyuki Shinohara, Tokyo, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01D 53/22 (2006.01); B01D 63/02 (2006.01);
U.S. Cl.
CPC ...
B01D 63/023 (2013.01); B01D 63/022 (2013.01); B01D 63/024 (2013.01);
Abstract

A module includes a bonded portion in which the hollow-fiber-membranes are bonded and fixed together by potting material at least in an end portion of each of the hollow-fiber-membranes. Each of the hollow-fiber-membranes has a resin impregnation portion in which resin is impregnated into an outer surface side of each of the hollow-fiber-membranes at least in the end portion where each of the hollow-fiber-membranes is bonded and fixed together. In the end portion of the hollow-fiber-membranes, a leading edge of the resin impregnation portion toward the other end of each of the hollow-fiber-membranes is located closer to the other end than a leading edge of the bonded portion toward the other end. The thickness of the resin impregnation portion in the direction of the wall thickness of the hollow-fiber-membranes is 10 to 70% with respect to the thickness of the hollow-fiber-membranes.


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