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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10159142 B1

PDFFull Text
Date of Patent:
Dec. 18, 2018

Filed:

Jun. 01, 2016

Printed wiring board with a reinforcing member having a diffusion-bonded nickel layer

Applicants:

Tatsuta Electric Wire & Cable Co., Ltd., Higashiosaka-shi, Osaka, JP;

Tokushu Kinzoku Excel Co., Ltd., Toshima-ku, Tokyo, JP;

Inventors:

Yuusuke Haruna, Kizugawa, JP;

Hiroshi Tajima, Kizugawa, JP;

Masahiro Watanabe, Kizugawa, JP;

Yukari Kobayashi, Tokyo, JP;

Kiyoharu Sekiguchi, Tokyo, JP;

Yoshihiro Hosoya, Tokyo, JP;

Assignee:

TATSUTA ELECTRIC WIRE & CABLE CO., LTD., Osaka, JP;

Attorney:

Potomac Law Group, PLLC

Primary Examiner:

Dimary Lopez Cruz

Assistant Examiner:

Muhammed Azam

Int. Cl.
CPC ...
H05K 1/02 (2006.01); B23K 20/02 (2006.01); B23K 20/00 (2006.01); B23K 20/24 (2006.01); B23K 35/00 (2006.01); B23K 35/02 (2006.01); B23K 1/19 (2006.01); H05K 3/32 (2006.01); H05K 1/09 (2006.01); H05K 1/18 (2006.01); B23K 20/16 (2006.01); B23K 20/227 (2006.01); B23K 101/42 (2006.01); B23K 103/04 (2006.01); B23K 103/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); B23K 1/19 (2013.01); B23K 20/002 (2013.01); B23K 20/023 (2013.01); B23K 20/16 (2013.01); B23K 20/227 (2013.01); B23K 20/24 (2013.01); B23K 35/002 (2013.01); B23K 35/0233 (2013.01); H05K 1/02 (2013.01); H05K 1/0215 (2013.01); H05K 1/0281 (2013.01); H05K 1/09 (2013.01); H05K 1/189 (2013.01); H05K 3/321 (2013.01); B23K 2101/42 (2018.08); B23K 2103/05 (2018.08); B23K 2103/18 (2018.08); B23K 2103/26 (2018.08);
Abstract

A printed wiring board includes a base member that includes a ground wiring pattern and a printed wiring board reinforcing member bonded to the ground wiring pattern in a conductive state. The printed wiring board reinforcing member includes a metal base material layer and a nickel layer bonded to at least a surface on a side opposite to a side bonded to the ground wiring pattern of the metal base material layer by diffusion bonding.

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