The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 18, 2018
Filed:
Dec. 19, 2014
Applicant:
Guangzhou Fang Bang Electronics Co., Ltd., Guangzhou, CN;
Inventor:
Zhi Su, Guangzhou, CN;
Assignee:
GUANGZHOU FANG BANG ELECTRONICS CO., LTD., Guangzhou, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); H05K 1/02 (2006.01); B32B 37/12 (2006.01); H01B 1/02 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0218 (2013.01); B32B 7/12 (2013.01); B32B 37/12 (2013.01); H01B 1/023 (2013.01); H01B 1/026 (2013.01); H05K 9/0081 (2013.01); H05K 9/0084 (2013.01); B32B 2307/202 (2013.01); B32B 2307/212 (2013.01); B32B 2457/08 (2013.01); H05K 1/0216 (2013.01); H05K 2201/0355 (2013.01); H05K 2201/0715 (2013.01);
Abstract
A free grounding film and a manufacturing method therefor, and a shielding circuit board including the free grounding film and a grounding method. The free grounding film includes at least one conductor layer. The shielding circuit board including the free grounding film is formed in a manner that an electromagnetic wave shielding film is arranged on a printed circuit board, and the upper surface of the electromagnetic wave shielding film is provided with the free grounding film. The grounding method for the shielding circuit board adopts one of three modes.