The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

Oct. 30, 2014
Applicant:

Goertek Inc., WeiFang, Shandong, CN;

Inventors:

Shuai Shao, WeiFang, CN;

Chao Xu, WeiFang, CN;

Lianwen Shan, WeiFang, CN;

Assignee:

GOERTEK INC., WeiFang, Shandong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04R 1/28 (2006.01); H04R 1/02 (2006.01); H04R 1/06 (2006.01); H04R 9/02 (2006.01); H04R 9/06 (2006.01);
U.S. Cl.
CPC ...
H04R 1/288 (2013.01); H04R 1/025 (2013.01); H04R 1/06 (2013.01); H04R 9/025 (2013.01); H04R 9/06 (2013.01); H04R 1/2865 (2013.01); H04R 2499/11 (2013.01);
Abstract

A speaker module comprising a module housing is disclosed. A speaker unit is accommodated within the module housing. A sound hole of the module is located at a side of the speaker unit. The speaker unit divides a cavity of the entire module into two cavities, namely a front acoustic cavity and a rear acoustic cavity. The front acoustic cavity is in communication with the sound hole. A sound-absorbing cotton is provided in the front acoustic cavity. The sound-absorbing cotton is fixed on the module housing, and is arranged to avoid a vibration space of a diaphragm of the speaker unit. The present invention effectively improves the performance of a sensitivity curve of the module at high frequencies without modifying the structure of the front acoustic cavity, thus not only increasing the acoustic performance of the module, but also simplifying the structure of the front acoustic cavity of the module.


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