The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

Mar. 20, 2015
Applicant:

Iljin Materials Co., Ltd., Iksan-si, Jeollabuk-do, KR;

Inventors:

Ki Deok Song, Suwon-si, KR;

Sun Hyoung Lee, Iksan-si, KR;

Tae Jin Jo, Seongnam-si, KR;

Seul Ki Park, Jindo-gun, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01M 4/66 (2006.01); H01M 10/0525 (2010.01); C25D 3/38 (2006.01); C25D 5/50 (2006.01); H01M 4/13 (2010.01); H01M 10/052 (2010.01); H01M 4/02 (2006.01);
U.S. Cl.
CPC ...
H01M 4/661 (2013.01); C25D 3/38 (2013.01); C25D 5/50 (2013.01); H01M 4/13 (2013.01); H01M 10/0525 (2013.01); H01M 10/052 (2013.01); H01M 2004/027 (2013.01); H01M 2220/20 (2013.01); Y02E 60/122 (2013.01);
Abstract

Disclosed is an electrolytic copper foil obtained by heat treating a copper foil manufactured through electrolysis, the electrolytic copper foil having specific resistivity of 1.68 to 1.72 μΩ·cm and a grain mean diameter of a crystallite of 1.0 to 1.5 μm.


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