The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 18, 2018

Filed:

Aug. 17, 2017
Applicants:

Boe Technology Group Co., Ltd., Beijing, CN;

Hefei Xinsheng Optoelectronics Technology Co., Ltd., Hefei, CN;

Inventors:

Litao Qu, Beijing, CN;

Chuan Yin, Beijing, CN;

Chia Hao Chang, Beijing, CN;

Shih Lun Chen, Beijing, CN;

Zhiqiang Jiang, Beijing, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/10 (2006.01); H01L 51/52 (2006.01); H01L 51/56 (2006.01);
U.S. Cl.
CPC ...
H01L 51/5246 (2013.01); H01L 51/524 (2013.01); H01L 51/5243 (2013.01); H01L 51/56 (2013.01);
Abstract

An organic electroluminescent display panel, a fabrication method thereof, and a display device are provided. The organic electroluminescent display panel includes: a base substrate and a package cover plate disposed opposite to each other, and an organic electroluminescent structure disposed on the base substrate and provided between the base substrate and the package cover plate. The package cover plate has a first groove for accommodating the organic electroluminescent structure within a display region of the organic electroluminescent display panel; the package cover plate has at least one second groove surrounding the first groove and having a closed boundary within a non-display region of the organic electroluminescent display panel; the second groove accommodates a sealant; and a metal layer is located between a protrusion portion of the package cover plate and the base substrate.


Find Patent Forward Citations

Loading…